Capillary actuator deployment

ABSTRACT

A method for making an actuator includes forming a substantially planar actuator device of an electrically conductive material, the device incorporating an outer frame, a fixed frame attached to the outer frame, a moveable frame disposed parallel to the fixed frame, a motion control flexure coupling the moveable frame to the outer frame for coplanar, rectilinear movement relative to the outer frame and the fixed frame, an actuator incorporating a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moveable frame, moving the moveable frame to a deployed position that is coplanar with, parallel to and spaced a selected distance apart from the fixed frame, and fixing the moveable frame at the deployed position for substantially rectilinear, perpendicular movement relative to the fixed frame.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/946,657 filed Nov. 15, 2010, which is incorporated herein byreference in its entirety as part of the present disclosure.

BACKGROUND

1. Technical Field

This disclosure generally relates to actuators and more particularlyrelates, for example, to MEMS actuators with motion control that aresuitable for use in miniature cameras or other devices and methods formaking them.

2. Related Art

Actuators for use in miniature cameras and other devices are well known.Such actuators typically comprise voice coils that are used to move alens for focusing, zooming, or optical image stabilization.

Miniature cameras are used in a variety of different electronic devices.For example, miniature cameras are commonly used in cellular telephones,laptop computers, and surveillance devices. Miniature cameras may havemany other applications.

It is frequently desirable to reduce the size of miniature cameras. Asthe size of electronic devices continues to be reduced, the size ofminiature cameras that are part of such electronic devices musttypically be reduced as well.

Further, it is desirable to enhance the shock resistance of suchminiature cameras. As the size of miniature cameras is reduced, smaller,more delicate components must often be utilized in their construction.Since such consumer products are typically subject to substantial abuse,such as rough handling and dropping, the components of miniature camerasmust be protected from the shock that is associated with such abuse.

Accordingly, a need exists for reduced sized actuator devices for use inminiature cameras and other devices that are capable of withstandingshock and abuse, along with reliable and cost effective methods formaking them.

SUMMARY

In accordance with the present disclosure, linear actuators suitable foruse in a variety of applications and methods for making them areprovided.

In one embodiment, an actuator comprises a substantially planar actuatordevice formed of an electrically conductive material and comprising anouter frame, a fixed frame attached to the outer frame, a moveable framedisposed parallel to the fixed frame, a motion control flexure couplingthe moveable frame to the outer frame for coplanar, rectilinear movementrelative to the outer frame and the fixed frame, and an actuatorincorporating a plurality of interdigitated teeth, a fixed portion ofwhich is attached to the fixed frame and a moving portion of which isattached to the moveable frame, wherein the moveable frame is fixed at adeployed position that is coplanar with, parallel to and spaced aselected distance apart from the fixed frame for substantiallyrectilinear, perpendicular movement relative thereto.

In another embodiment, a method for making an actuator comprises forminga substantially planar actuator device of an electrically conductivematerial and comprising an outer frame, a fixed frame attached to theouter frame, a moveable frame disposed parallel to the fixed frame, amotion control flexure coupling the moveable frame to the outer framefor coplanar, rectilinear movement relative to the outer frame and thefixed frame, and an actuator incorporating a plurality of interdigitatedteeth, a fixed portion of which is attached to the fixed frame and amoving portion of which is attached to the moveable frame, then movingthe moveable frame to a deployed position that is coplanar with,parallel to and spaced a selected distance apart from the fixed frame,and fixing the moveable frame at the deployed position for substantiallyrectilinear, perpendicular movement relative to the fixed frame.

The scope of the disclosure is defined by the claims, which areincorporated into this section by reference. A more completeunderstanding of embodiments will be afforded to those skilled in theart, as well as a realization of additional advantages thereof, by aconsideration of the following detailed description of one or moreembodiments. Reference will be made to the appended sheets of drawingsthat will first be described briefly.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 illustrates an electronic device having an actuator device, inaccordance with an embodiment.

FIG. 2 illustrates a miniature camera having a lens barrel, inaccordance with an embodiment.

FIG. 3A illustrates the lens barrel having an actuator module disposedtherein, in accordance with an embodiment.

FIG. 3B illustrates the lens barrel and an actuator module in anexploded view, in accordance with an embodiment.

FIG. 4 illustrates the actuator module having the actuator devicedisposed therein, in accordance with an embodiment.

FIG. 5A illustrates a top view of the actuator device, in accordancewith an embodiment.

FIG. 5B illustrates a top view of the actuator device, in accordancewith an embodiment.

FIG. 6A illustrates a portion of the actuator device, in accordance withan embodiment.

FIG. 6B illustrates a portion of the actuator device, in accordance withan embodiment.

FIG. 6C illustrates a portion of a platform, in accordance with anembodiment.

FIG. 6D illustrates a bottom view of a movable lens positioned formounting to the actuator device, in accordance with an embodiment.

FIG. 6E illustrates a side view of the movable lens mounted to theactuator device, in accordance with an embodiment.

FIG. 7 illustrates portions of the actuator device, in accordance withan embodiment.

FIG. 8 illustrates a bottom view of the actuator device in a deployedconfiguration, in accordance with an embodiment.

FIG. 9A illustrates a portion of the actuator device in a deployedconfiguration without any voltage applied thereto, in accordance with anembodiment.

FIG. 9B illustrates a portion of the actuator device in a deployedconfiguration with a small voltage applied thereto, in accordance withan embodiment.

FIG. 9C illustrates a portion of the actuator device in a deployedconfiguration with a maximum voltage applied thereto, in accordance withan embodiment.

FIG. 10 illustrates a lateral snubber assembly, in accordance with anembodiment.

FIG. 11 illustrates a hinge flexure and a motion control torsionalflexure, in accordance with an embodiment.

FIG. 12 illustrates an inner motion control hinge, in accordance with anembodiment.

FIG. 13 illustrates a cantilever flexure, in accordance with anembodiment.

FIG. 14 illustrates a serpentine contact flexure and a deploymenttorsional flexure, in accordance with an embodiment.

FIG. 15 illustrates a top view of a deployment stop, in accordance withan embodiment.

FIG. 16 illustrates a bottom view of the deployment stop, in accordancewith an embodiment.

FIG. 17A illustrates a flap damper, in accordance with an embodiment.

FIG. 17B illustrates a movable frame disposed between an upper modulecover and a lower module cover with no shock applied, in accordance withan embodiment.

FIG. 17C illustrates the movable frame disposed between the upper modulecover and the lower module cover with a shock applied, in accordancewith an embodiment.

FIG. 17D illustrates a partial top view of another actuator device, inaccordance with an embodiment.

FIG. 17E illustrates an enlarged top view of the actuator device, inaccordance with an embodiment.

FIG. 17F illustrates an outer hinge flexure, a lateral snubber assembly,a single snubber flap and an interlocking snubber flaps feature of theactuator device, in accordance with an embodiment.

FIGS. 17G and 17H illustrate the outer hinge flexure, in accordance withan embodiment.

FIGS. 17I and 17J illustrate the lateral snubber assembly, in accordancewith an embodiment.

FIGS. 17K and 17L illustrate cross-sectional views of the single snubberflap and the interlocking snubber flaps, in accordance with anembodiment.

FIG. 17M illustrates a top view of the lateral snubber assembly, thesingle snubber flap and the interlocking snubber flaps, in accordancewith an embodiment.

FIG. 17N illustrates cross-sectional views of the single snubber flapand the interlocking snubber flaps, in accordance with an embodiment.

FIG. 18 illustrates a ball-in-socket snubber, in accordance with anembodiment.

FIG. 19 illustrates the ball-in-socket snubber and two frame hinges, inaccordance with an embodiment.

FIG. 20 illustrates an actuator device, in accordance with anembodiment.

FIG. 21A illustrates the actuator device in an un-deployed state, inaccordance with an embodiment.

FIG. 21B illustrates the actuator device in a deployed state, inaccordance with an embodiment.

FIG. 22A illustrates a deployment stop of the actuator device in anun-deployed state, in accordance with an embodiment.

FIG. 22B illustrates the deployment stop in a deployed state, inaccordance with an embodiment.

FIG. 23 illustrates an actuator device, in accordance with anembodiment.

FIG. 24 illustrates an actuator, in accordance with an embodiment.

FIG. 25A-25C illustrate a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 26 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 27 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 28 illustrates an over-center latch useful for locking the actuatordevice in the deployed position, in accordance with an embodiment.

FIG. 29 illustrates a ball and socket useful in the method for deployingthe actuator device, in accordance with an embodiment.

FIG. 30 illustrates another ball and socket useful in the method fordeploying the actuator device, in accordance with an embodiment.

FIG. 31 illustrate a tab and post useful in the method for deploying theactuator device and for locking it in the deployed position, inaccordance with an embodiment.

FIG. 32 illustrates the tab and post being used in the method fordeploying the actuator device and for locking it in the deployedposition, in accordance with an embodiment.

FIG. 33 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 34 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 35 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 36 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 37 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 38 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 39 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 40 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 41 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIG. 42 illustrates a method for deploying the actuator device, inaccordance with an embodiment.

FIGS. 43A and 43B illustrate methods for deploying the actuator device,in accordance with an embodiment.

FIG. 44 illustrates a method for deploying the actuator device and forfixing it in the deployed position, in accordance with an embodiment.

FIG. 45 illustrates a method for deploying the actuator device and forfixing it in the deployed position, in accordance with an embodiment.

FIG. 46 illustrates a method for deploying the actuator device and forfixing it in the deployed position, in accordance with an embodiment.

FIG. 47 illustrates a method for deploying the actuator device and forfixing it in the deployed position, in accordance with an embodiment.

FIG. 48 illustrates a method for deploying the actuator device and forfixing it in the deployed position, in accordance with an embodiment.

FIGS. 49A-49F illustrate a method for making a gap between two sectionsof the actuator device, in accordance with an embodiment.

FIG. 50 illustrates an interlocking flap damper, in accordance with anembodiment.

FIG. 51 illustrates features of the interlocking flap damper, inaccordance with an embodiment.

FIGS. 52A-52B illustrate other features of the interlocking flap damper,in accordance with an embodiment.

FIGS. 53A-53B illustrate other features of the interlocking flap damper,in accordance with an embodiment.

Embodiments of the disclosure and their advantages are best understoodby referring to the detailed description that follows. It should beappreciated that like reference numerals are used to identify likeelements illustrated in one or more of the figures.

DETAILED DESCRIPTION

An actuator device suitable for use in a wide variety of differentelectronic devices is disclosed in accordance with various embodiments.The actuator device may be adapted for use in a camera, such as aminiature camera, for example. The actuator device may be used to eithermanually or automatically focus the miniature camera. The actuatordevice may be used to zoom the miniature camera or to provide opticalimage stabilization for the miniature camera. The actuator device may beused to align the optics within the camera. The actuator device may beused for any other desired application in an electronic device or in anyother device.

In accordance with one or more embodiments, the actuator device maycomprise one or more MEMS actuators. The actuator device may be formedusing monolithic construction. The actuator device may be formed usingnon-monolithic construction.

The actuator device may be formed using contemporary fabricationtechniques, such as etching and micromachining, for example. Variousother fabrication techniques are contemplated.

The actuator device may be formed of silicon (e.g., single crystalsilicon and/or polycrystalline silicon). The actuator device may beformed of other semiconductors such as silicon, germanium, diamond, andgallium arsenide. The material of which the actuator device is formedmay be doped to obtain a desired conductivity thereof. The actuatordevice may be formed of a metal such as tungsten, titanium, germanium,aluminum, or nickel. Any desired combination of such materials may beused.

Motion control of the actuator device and/or items moved by the actuatordevice is disclosed in accordance with various embodiments. The motioncontrol may be used to facilitate a desired movement of an item whilemitigating undesired movement of the item. For example, the motioncontrol may be used to facilitate movement of a lens along an opticalaxis of the lens, while inhibiting other movements of the lens. Thus,the motion control may be used to facilitate movement of the lens insingle desired translational degree of freedom while inhibiting movementof the lens in all other translational degrees of freedom and whileinhibiting movement of the lens in all rotational degrees of freedom. Inanother example, the motion control may facilitate movement of the lensin all three translational degrees of freedom while inhibiting movementof the lens in all rotational degrees of freedom.

Thus, an enhanced miniature camera for standalone use and for use inelectronic devices may be provided. The miniature camera is suitable foruse in a wide variety of different electronic devices. For example, theminiature camera is suitable for use in electronic devices such ascellular telephones, laptop computers, televisions, handheld devices,and surveillance devices.

According to various embodiments, smaller size and enhanced shockresistance are provided. Enhanced fabrication techniques may be used toprovide these and other advantages. Such fabrication techniques mayadditionally enhance the overall quality and reliability of miniaturecameras while also substantially reducing the cost thereof.

FIG. 1 illustrates an electronic device 100 having an actuator device400, in accordance with an embodiment. As discussed herein, the actuatordevice 400 may have one or more actuators 550. In one embodiment, theactuators 550 may be MEMS actuators, such as electrostatic comb driveactuators. In one embodiment, the actuators 550 may be rotational combdrive actuators.

The electronic device 100 may have one or more actuators 550 for movingany desired component thereof. For example, the electronic device 100may have an optical device such as a miniature camera 101 that has theactuator 550 for moving optical elements such as one or more movablelenses 301 (shown in FIG. 2) that are adapted to provide focus, zoom,and/or image stabilization. The electronic device 100 may have anydesired number of the actuators 550 for performing any desiredfunctions.

The electronic device 100 may be a cellular telephone, a laptopcomputer, a surveillance device, or any other desired device. Theminiature camera 101 may be built into the electronic device 100, may beattached to the electronic device 100, or may be separate (e.g., remote)with respect to the electronic device 100.

FIG. 2 illustrates the miniature camera 101 having a lens barrel 200, inaccordance with an embodiment. The lens barrel 200 may contain one ormore optical elements, such as the movable lens 301, which may be movedby the actuator device 400 (shown in FIG. 1). The lens barrel 200 mayhave one or more optical elements which may be fixed. For example, thelens barrel 200 may contain one or more lenses, apertures (variable orfixed), shutters, mirrors (which may be flat, non-flat, powered, ornon-powered), prisms, spatial light modulators, diffraction gratings,lasers, LEDs and/or detectors. Any of these items may be fixed or may bemovable by the actuator device 400.

The actuator device 400 may move non-optical devices such as samplesthat are provided for scanning. The samples may be either biologicalsamples or non-biological samples. Examples of biological samplesinclude organisms, tissues, cells, and proteins. Examples ofnon-biological samples include solids, liquids, and gases. The actuatordevice 400 may be used to manipulate structures, light, sound, or anyother desired thing.

The optical elements may be partially or fully contained within the lensbarrel 200. The lens barrel 200 may have any desired shape. For example,the lens barrel 200 may be substantially round, triangular, rectangular,square, pentagonal, hexagonal, octagonal, or of any other shape orcross-sectional configuration. The lens barrel 200 may be eitherpermanently or removably attached to the miniature camera 101. The lensbarrel 200 may be defined by a portion of a housing of the miniaturecamera 101. The lens barrel 200 may be partially or completely disposedwithin the miniature camera 101.

FIG. 3A illustrates an actuator module 300 disposed within the lensbarrel 200, in accordance with an embodiment. The actuator module 300may contain the actuator device 400. The actuator device 400 may becompletely contained within the lens barrel 200, partially containedwithin the lens barrel 200, or completely outside of the lens barrel200. The actuator device 400 may be adapted to move optical elementscontained within the lens barrel 200, optical elements not containedwithin the lens barrel 200, and/or any other desired items.

FIG. 3B illustrates the lens barrel 200 and the actuator module 300 inan exploded view, in accordance with an embodiment. The movable lens 301is an example of an optical element that may be attached to the actuatordevice 400 and may be moved thereby. The actuator device 400 may bedisposed intermediate an upper module cover 401 and a lower module cover402.

Additional optical elements, such as fixed (e.g., stationary) lenses 302may be provided. The additional optical elements may facilitate focus,zoom, and/or optical image stabilization, for example. Any desirednumber and/or type of movable (such as via the actuator device 400) andfixed optical elements may be provided.

FIG. 4 illustrates the actuator module 300, in accordance with anembodiment. The actuator module 300 may be disposed partially orcompletely within the miniature camera 101. The actuator device 400 maybe disposed partially or completely within the actuator module 300. Forexample, the actuator device 400 may be sandwiched substantially betweenan upper module cover 401 and a lower module cover 402.

The actuator module 300 may have any desired shape. For example, theactuator module 300 may be substantially round, triangular, square,rectangular, pentagonal, hexagonal, octagonal, or of any other shape orcross-sectional configuration.

In one embodiment, the lens barrel 200 may be substantially round incross-sectional configuration and the actuator module 300 may besubstantially round in cross-sectional configuration. The use of asubstantially round lens barrel 200 and a substantially round actuatormodule 300 may facilitate an advantageous reduction in size. Thereduction in size may be facilitated, for example, because round lensesare commonly preferred. The use of a substantially round lens barrel 200and a substantially round actuator module 300 with round lenses tends toresult in a reduction of wasted volume and thus tends to facilitate areduction in size.

As discussed herein, one or more optical elements, such as the movablelens 301, may be disposed in an opening 405 (e.g., a hole) formed in theactuator module 300. Actuation of the actuators 550 may effect movementof the optical elements along their optical axis 410, for example. Thus,actuation of the actuators 550 may move one or more lenses to effectfocusing or zoom, for example.

The actuator module 300 may have cutouts 403 formed therein tofacilitate assembly of the actuator module 300 and alignment of theactuator device 400 contained therein. The cutouts 403 and/or electricalcontacts 404 partially disposed within the cutouts 403 may be used tofacilitate alignment of the actuator module 300 with respect to the lensbarrel 200.

FIG. 5A illustrates a top view of the actuator device 400 having theelectrical contacts 404, the opening 405, inner hinge flexures 501,kinematic mount flexures 502, movable frames 505, an outer frame 506,serpentine contact flexures 508, deployment torsional flexures 509,deployment stops 510, flap dampers 511, ball-in-socket snubbers 513,cantilever flexures 514, motion control torsional flexures 515, outerhinge flexures 516, a fixed frame 517, a platform 520, lens pads 521, apivot axis 525, the actuators 550, spaces 551, and blocks 552, inaccordance with an embodiment.

Blocks 552 (FIG. 5A) are shown to represent teeth 560 (see FIGS. 5B and7) of the actuator 550 in some figures. Those skilled in the art willappreciate that comb drives typically comprise a large number of verysmall teeth 560 that are difficult to show graphically on a drawing ofthis scale. For example, the actuator 550 may have between 1 and 10,000teeth on each side thereof and may have approximately 2,000 teeth oneach side thereof. Thus, in one embodiment, the blocks 552 may notrepresent the actual configuration of the teeth 560, but rather areshown in place of the teeth 560 to better illustrate the operation ofthe actuators 550, as discussed herein.

In accordance with an embodiment, the actuator device 400 may besubstantially hexagonal in shape. The hexagonal shape readilyfacilitates placement of the actuator device 400 within thesubstantially round lens barrel 200. The hexagonal shape alsofacilitates efficient use of wafer real estate. Other shapes arecontemplated.

The actuator device 400 may have a plurality of the actuators 550. Onlyone actuator 550 is illustrated in detail in FIG. 5A. The spaces 551 areshown in FIG. 5A for two additional actuators 550 that are notillustrated in detail. Thus, in one embodiment the actuator device 400may have three actuators 550 disposed in a substantially radiallysymmetric pattern about the opening 405 such that the actuators 550 arespaced approximately 120° apart from one another. The actuator device400 may have any desired number of the actuators 550 disposed in anydesired pattern. As further examples, the actuator device 400 may havetwo actuators 550 spaced approximately 180° apart from one another ormay have four actuators 550 spaced approximately 90° apart from oneanother.

As discussed herein, the actuators 550 may include one or more MEMSactuators, voice coil actuators, or any other desired type orcombination of types of actuators. For example, in one embodiment, eachactuator 550 may be a vertical rotational comb drive.

The actuators 550 may cooperate with one another to move a platform 520along the optical axis 410 (FIG. 3B), which in FIG. 5A is perpendicularto the plane of the actuator device 400. The actuators 550 may cooperatewith one another to move the platform 520 in a manner that maintains theplatform 520 substantially orthogonal with respect to the optical axis410 and in a manner that substantially mitigates rotation of theplatform 520.

Actuation of the actuators 550 is accomplished by the application of avoltage differential between adjacent teeth 560, represented by blocks552. Such actuation effects rotation of the actuators 550 to facilitatethe herein described movement of the platform 520.

In various embodiments, the platform 520 may be adapted substantially asa ring (e.g., as shown in FIG. 5A). Other shapes are contemplated. Theplatform 520 may have any desired 20. shape.

Prior to deployment, the actuator device 400 may be a substantiallyplanar structure. For example, the actuator device 400 may besubstantially formed from a single, monolithic piece of material, suchas silicon. The actuator device 400 may be formed from a single die. Thedie may be approximately 4 to 5 millimeters across and approximately 150microns thick, for example.

The actuator device 400 may be formed by a MEMS technique, such asmilling or etching. A plurality of actuator devices 400 may be formedupon a single wafer. The overall shape or footprint of the actuatordevice 400 may be adapted to enhance the formation of a plurality of theactuator devices 400 on a single wafer.

Prior to operation, the fixed frame 517 of each actuator 550 may bedeployed to offset the adjacent pairs of teeth 560 represented by blocks552 with respect to one another, in accordance with an embodiment.Deployment may result in a substantially non-planar overallconfiguration of the actuator device 400. When deployed, each actuator550 may have a portion thereof (e.g., the fixed frame 517) extendingfrom the plane of the outer frame 506. The fixed frame 517 may extendfrom the plane of the outer frame 506 at an angle with respect thereto.Thus, when deployed, the fixed frame 517 may be substantiallyout-of-plane with respect to the outer frame 506.

Once deployed, the fixed frames 517 may be fixed or locked into positionsuch that they do not move further with respect to the outer frame 506,and are angularly offset or rotated with respect to the outer frame 506and with respect to the movable frame 505 (when the actuator 550 is notactuated). The fixed frames 517 may be mechanically fixed in position,adhesively bonded in position, or any desired combination ofmechanically fixed and adhesively bonded.

Actuation of the actuator 550 may cause the movable frame 505 to rotatetoward the deployed fixed frame 517 to effect desired movement of theplatform 520. Motion control torsional flexures 515 and outer hingeflexures 516 cooperate to facilitate motion controlled rotation of themovable frame 505, as discussed herein. The movable frame 505 rotatesabout the pivot axis 525.

FIG. 5B illustrates a top view of the actuator device 400 having teeth560 shown in the actuator 550 in place of the blocks 552 representativethereof, in accordance with an embodiment. The teeth 560 shown may beconsidered to be reduced in number and exaggerated in size for clarityin FIG. 5B.

FIG. 6A illustrates a top view of one of the actuators 550 having theinner hinge flexures 501, the ball-in-socket snubbers 513, the movableframe 505, the outer hinge flexures 516, the motion control torsionalflexures 515, the cantilever flexures 514, the fixed frame 517, thepivot axis 525, the serpentine contact flexure 508, the pseudokinematicmount and electrical contact 404, and the platform 520, in accordancewith an embodiment. FIG. 6A further illustrates a lateral snubberassembly 1001, which is further described herein.

The inner hinge flexure 501 cooperates with the cantilever flexure 514to transfer desired motion from the movable frame 505 to the platform520. Thus, actuation of the actuator 550 results in rotation of themovable frame 505, which in turn results in translation of the platform520, as discussed herein.

The movable frame 505 may pivot on the outer hinge flexures 516 in afashion similar to a door pivoting on its hinges. Upon the applicationof a shear force to the actuator device 400, one of the two outer hingeflexures 516 of the actuator 550 may be in tension while the outer hingeflexure 516 may be in compression. The two motion control torsionalflexures 515 tend to mitigate undesirable buckling of the outer hingeflexure 516 in such instances.

Each actuator may be substantially disposed within a motion controlmechanism that provides comparatively high lateral stiffness andcomparatively soft rotational stiffness. In one embodiment, the motioncontrol mechanism may have one or more (e.g., two) outer hinges flexures516 and may have one or more (e.g., two) motion control torsionalflexures 515. Thus, movement of the movable frame 505 may besubstantially constrained to desirable rotation thereof.

In one embodiment, the motion control mechanism for one actuator 550 maycomprise the outer frame 506, movable frame 505, the motion controltorsional flexures 515, the outer hinge flexures 516, the inner hingeflexures 501, the cantilever flexure 514, and the platform 520. In oneembodiment, the motion control mechanism may comprise all structuresthat tend to limit movement of the platform 520 to desired translationalmovement.

Each actuator 550 may be substantially contained within the motioncontrol mechanism to substantially limit competition for real estate onthe actuator device 400, in accordance with an embodiment. Since eachactuator 550 and its associated motion control mechanism occupysubstantially the same surface area of the actuator device 400, they donot compete for real estate. Thus, as the actuator 550 increases insize, its associated motion control mechanism may also increase in size.In certain embodiments, it is desirable to increase the size of anactuator 550 to increase the force provided thereby. In certainembodiments, it is desirable to also increase the size of the motioncontrol mechanism to maintain its ability to desirably limit movement ofthe platform 520. The movable frame 550 may be considered as a portionof the motion control mechanism.

FIG. 6B illustrates the actuator 550 showing the fixed frame 517 shadedfor clarity, in accordance with an embodiment. The shaded fixed frame517 may be deployed to a position out-of-plane of the actuator device400 and may be fixed in this deployed position.

The movable frame 505 may support moving portions of the actuator 550,such as some of the teeth 560 (see FIG. 7). The fixed frame 517 maysupport fixed portions of the actuator 550, such as others of the teeth560 (see FIG. 7). The application of a voltage to the actuator 550 maycause the movable frame 505 to rotate about the outer hinge flexures 516toward the fixed frame 517. Removal or reduction of the voltage maypermit a spring force applied by the inner hinge flexures 514, the outerhinge flexures 516 and the motion control torsional flexure 515 torotate the movable frame 505 away from the fixed frame 517. Sufficientclearance between the movable frame 505 and the fixed frame 517 may beprovided to accommodate such desired movement.

FIG. 6C illustrates a portion of the platform 520 having radialvariations 571, in accordance with an embodiment. In one embodiment, theradial variations 571 may be formed in the platform 520 to permit theplatform 520 to expand. The radial variations 571 may be angular bendsin the platform 520. Thus, an optical element such as the movable lens301 may be inserted into the opening 405 of the platform 520, which mayexpand to receive the movable lens 301 and which may grip the movablelens 301. The opening 405 may expand as the radial variations 571 of theplatform 520 deform (e.g., tend to straighten), so as to increase thecircumference of the opening 405.

FIG. 6D illustrates a perspective view of a movable lens positioned formounting to the actuator device 400 and FIG. 6E illustrates a side viewof the movable lens 301 attached to the actuator device 400, inaccordance with an embodiment. In one embodiment, the movable lens 301may be adhesively bonded to the platform 550, such as by adhesivelybonding standoffs 522 of the movable lens 301 to the lens pads 521. Forexample, epoxy 523 may be used to adhesively bond the movable lens 301to the platform 520. The movable lens 301 may be supported by the lenspad 521.

FIG. 7 illustrates a portion of the actuator 550 showing blocks 552superimposed over the teeth 560 of an actuator 550, in accordance withan embodiment. As discussed herein, the blocks 552 are representative ofthe teeth 560.

FIG. 8 illustrates a bottom perspective view of the actuator device 400in a deployed configuration, in accordance with an embodiment. In thedeployed configuration the unactuated movable frame 505 is substantiallyin-plane with respect to the outer frame 506 and the deployed fixedframe 517 is substantially out-of-plane with respect to the outer frame506 and the movable frame 505.

A voltage may be applied to each actuator 550 via the electricalcontacts 404. For example, two of the three contacts 404 may be used toapply a voltage from the lens barrel 200 to the actuator device 400. Thethird contact 404 may be unused or may be used to redundantly apply onepolarity of the voltage from the lens barrel 200 to the actuator device400.

Substantially the same voltage may be applied to the three actuators 550to result in substantially the same movement of the moving frames 505thereof. Application of substantially the same voltage to the threeactuators 550 may result in translation of the platform 520 with respectto the outer frame 506 such that the platform 520 remains substantiallyparallel to the outer frame 506. Thus, an optical element such as themovable lens 301 may be maintained in a desired alignment as the opticalelement is moved, such as along an optical axis 410 (FIG. 3B) thereof.

Substantially different voltages may be applied to the three actuators550 to result in substantially different movements of the moving frames505 thereof Substantially different voltages may be applied to the threeactuators 550 using the three contacts 404 and a common return. Thus,each contact 404 may apply a separately controlled voltage to adedicated one of the three actuators 550.

The application of substantially different voltages to the threeactuators 550 may result in translation of the platform 520 with respectto the outer frame 506 such that the platform tilts substantially withrespect to the outer frame 506. Thus, when substantially differentvoltages are applied, the platform 520 does not necessarily remainsubstantially parallel to the outer frame. The application of differentvoltages to the three actuators 550 may be used to align the platform520 to the outer frame 506, for example. The application of differentvoltages to the three actuators 550 may be used to facilitate opticalimage stabilization or lens alignment, for example.

FIG. 9A illustrates a portion of the actuator device 400 in a deployedconfiguration without any voltage applied thereto, in accordance with anembodiment. Without any voltage applied to the actuator device 400, themovable frame 505 is substantially in-plane with respect to the outerframe 506 and the deployed fixed frame 517 is substantially out-of-planewith respect to the outer frame 506 and the movable frame 505.

FIG. 9B illustrates a portion of the actuator device 400 in a deployedconfiguration with a small voltage applied thereto, in accordance withan embodiment. With the small voltage applied, the movable frame 505 hasrotated toward the deployed fixed frame 517 and is in a partiallyactuated position.

FIG. 9C illustrates a portion of the actuator device 400 in a deployedconfiguration with a maximum voltage applied thereto, in accordance withan embodiment. As may be seen, the movable frame 505 has rotated furthertoward the deployed fixed frame 517 and is in a fully actuated position.

FIG. 10 illustrates a top view of a lateral snubber assembly 1001, inaccordance with an embodiment. The lateral snubber assembly 1001 mayhave a first snubber member 1002 and a second snubber member 1003. Thefirst snubber member 1002 may be formed upon the fixed frame 517 and thesecond snubber member may be formed upon the movable frame 505. Thefirst snubber member 1002 and the second snubber member 1003 maycooperate to inhibit undesirable lateral motion of the movable frame 505with respect to the fixed frame 517 (and consequently with respect tothe outer frame 506, as well) during shock or large accelerations. A gap“D” between the first snubber member 1002 and the second snubber member1003 may approximately 2-3 micrometers wide to limit such undesirablelateral motion.

FIG. 11 illustrates a perspective view of the motion control torsionalflexure 515 and the outer hinge flexure 516, in accordance with anembodiment. The motion control torsional flexure 515 and the outer hingeflexure 516 may be thinner than other portions of the actuator device400 to provide the desired stiffness of the motion control torsionalflexure 515 and the outer hinge flexure 516. For example, in oneembodiment the outer hinge flexures 516, the inner hinge flexures 501,and the motion control torsional flexures 515 may have a width ofapproximately 100 microns and a thickness of approximately 2-3 microns.

The motion control torsional flexure 515 may be located on the pivotaxis 525. In one embodiment, the pivot axis 525 is a line that connectsthe centers of the two outer hinge flexures 516. In one embodiment, thepivot axis 525 is the hinge line or axis about which the movable frame506 rotates.

FIG. 12 illustrates a perspective view of an inner hinge flexure 501, inaccordance with an embodiment. The inner hinge flexure 501 may bethinner than other portions of the actuator device 400 to provide thedesired stiffness of the inner hinge flexure 501. For example, in oneembodiment, the inner hinge flexure 501 may be approximately 500micrometers long, 60 micrometers wide, and 2-3 micrometers thick.

FIG. 13 illustrates a perspective view of a cantilever flexure 514having the inner hinge flexure 501, a first thinned section 1301, athicker section 1302, and a second thinned section 1303, in accordancewith an embodiment. The cantilever flexure 514 may be used to transfermovement of the movable frames 505 to the platform 520. The cantileverflexure 514 may be used to facilitate the conversion of rotation of themovable frames 505 into translation of the platform 520.

The inner hinge flexure 501 may bend to permit the movable frame 505 torotate while the platform 520 translates. The first thinned section 1301and the second thinned section 1303 may bend to permit a change indistance between the movable frame 505 and the platform 520 as themovable frame 505 transfers movement to the platform 520.

The cantilever flexure 514 may be thinner proximate the ends thereof andmay be thicker proximate the center thereof. Such configuration maydetermine a desired ratio of stiffnesses for the cantilever flexure 514.For example, it may be desirable to have a comparatively low stiffnessradially to compensate for the change in distance between the movableframes 505 and the platform 520 as the movable frame 505 transfersmovement to the platform 520.

FIG. 14 illustrates a perspective view of the serpentine contact flexure508 and the deployment torsional flexure 509, in accordance with anembodiment. The serpentine contact flexure 508 may facilitate electricalcontact between the electrical contacts 404 and the deployed fixedframe. The deployment torsional flexures 509 may facilitate rotation ofthe deployed fixed frame 517 with respect to the outer frame 506 duringdeployment.

FIG. 15 illustrates a perspective top view of a deployment stop 510showing that it does not contact an outer frame 506 on the top side whendeployed, in accordance with an embodiment. An epoxy 1501 may be appliedto the top surfaces of the deployment stop 510 and the outer frame 506to fix the deployment stop 510 into position with respect to the outerframe 506. Thus, the epoxy 1501 may fix the deployed fixed frame 517into position with respect to the outer frame 506. Various portions ofthe deployed fixed frame 517 may function as the deployment stops 517.For example, other portions of the deployed fixed frame 517 that abutthe outer frame 506 when the deployed fixed frame is deployed mayfunction as the deployment stops 510.

FIG. 16 illustrates a perspective bottom view of the deployment stop 510showing that it contacts the outer frame 506 on the bottom side whendeployed, in accordance with an embodiment. The epoxy 1501 may beapplied to the bottom surfaces of the deployment stop 510 and the outerframe 506 to fix the deployment stop 510 into position with respect tothe outer frame 506. The epoxy 1501 may be applied to both the topsurfaces and the bottom surfaces of the deployment stop 510 and theouter frame 506, if desired.

FIG. 17A illustrates a perspective view of a flap damper 511, inaccordance with an embodiment. The flap damper 511 is located where thedesirable relative motion during intended operation, (e.g., actuation)of actuators 550, is comparatively low and where the potentialundesirable relative motion during shock is comparatively high. Forexample, the flap damper 511 may be formed on the pivot axis 525.

A damping material 1701 may extend across a gap 1702 formed between theouter frame 506 and the movable frame 505. The damping material 1701 mayhave a high damping coefficient. For example, in one embodiment, thedamping material 1701 may have a damping coefficient of between 0.7 and0.9. For example, the damping material 1701 may have a dampingcoefficient of approximately 0.8. In one embodiment, the dampingmaterial 1701 may be an epoxy.

The damping material 1701 may readily permit the desired motion of themovable frame 505 relative to the outer frame 506. The damping material1701 may inhibit undesired motion of the movable frame 505 relative tothe outer frame 506 due to a shock. Thus, the damping material 1701 maypermit rotation of the movable frame 505 relative to the outer frame 506during actuation of the actuators 550 and may inhibit lateral motionand/or out of plane motion of the movable frame 505 relative to theouter frame 506 during a shock.

The flap damper 511 may have a flap 1706 that extends from the movableframe 505 and may have a flap 1707 that extends from the outer frame506. A gap 1702 may be formed between the flap 1706 and the flap 1707.

An extension 1708 may extend from the flap 1706 and/or an extension 1709may extend from the flap 1707. The extension 1708 and the extension 1709may extend the length of the gap 1702 such that more damping material1701 may be used than would be possible without the extension 1708and/or the extension 1709.

Trenches 1719 may be formed in flaps 1706 and/or 1707 and a trenchmaterial 1720 that is different from the material of the flaps 1706 and1707 may be deposited within the trenches 1719. For example, the flaps1706 and 1707 may be formed of single crystalline silicon and the trenchmaterial 1720 may be formed of polycrystalline silicon. Any desiredcombination of materials may be used for the flaps 1706 and 1707 and forthe trench material 1720, so as to achieve the desired stiffness of theflaps 1706 and 1707.

FIG. 17B illustrates the movable frame 505 disposed between the uppermodule cover 401 and the lower module cover 402 without a shock beingapplied thereto. In the absence of a shock, the movable frame 505remains in its unactuated position and the outer hinge flexure 516 isunbent.

FIG. 17C illustrates the movable frame 505 after it has been moved to aposition against the lower module cover 402 by a shock, such as may becaused by dropping the electronic device 100. Movement of the movableframe 505 may be limited or snubbed by the lower module housing 402 andundesirable double bending of the outer hinge flexure 516 may be limitedthereby. In a similar fashion, the upper module housing 401 may limitmovement of the movable frame 505 and double bending of the outer hingeflexure 516. Thus, undesirable stress within the outer hinge flexures516 may be mitigated.

FIGS. 17D-17H illustrate an alternative embodiment of an outer hingeflexure 1752. As illustrated in these figures, in some embodiments, theouter hinge flexures 1752 may be X-shaped for increased control of themotion of the moveable frame 505 in the lateral direction.

The outer hinge flexures 516, 1752 may generally tend to bend, such asabout a central portion thereof, to facilitate movement of the moveableframe 505 with respect to the outer frame 506. Other shapes arecontemplated. For example, the outer hinge flexure 1752 can be shapedlike a H, I, M, N, V, W, Y, or may have any other desired shape. Eachouter hinge flexure 1752 can comprise any desired number of structuresthat interconnect the outer frame 506 and the movable frame 505. Thestructures may be interconnected or may not be interconnected. Thestructures may be substantially identical with respect to one another ormay be substantially different with respect to one another. Each outerhinge flexure 1752 may be substantially identical with respect to eachother hinge flexure 1752 or may be substantially different with respectthereto.

The outer hinge flexures 516, 1752 and any other structures may beformed by etching as discussed herein. The outer hinge flexure and anyouter structures may comprise single crystalline silicon,polycrystalline silicon, or any combination thereof.

FIGS. 17D-F and 17I-17N show an alternative embodiment of the lateralsnubber assembly 1754, another embodiment of which is discussed above inconnection with FIG. 10 herein. The lateral snubber assembly 1754 ofFIGS. 17D-F and 17I-17N generally has more rounded curves with respectto the lateral snubber assembly 1001 of FIG. 10.

FIGS. 17D-17F and 17K-17N illustrate an example embodiment of aninterlocking snubber flaps feature 1756 useful for constraining bothvertical movement of a component, e.g., moveable component 505, in the±Z directions, as well as lateral movement thereof, i.e., in the ±Xand/or Y directions. As may be seen in the cross-sectional views ofFIGS. 17K, 17L and 17N, the structure of and methods for forming theinterlocking flaps feature 1756 are similar to those of the interlockingflaps feature 5000 discussed in detail below in connection with FIGS.49-53.

As illustrated in FIG. 17F, the interlocking snubber flaps feature 1756includes the formation of a pair of flaps 1756A and 1756B respectivelyextending from moveable and fixed components 505 and 506 and over acorresponding shoulder 1762 formed on the other, opposing component. Theflap 1756A on the moveable component 505 limits motion of the moveablecomponent 505 in the −Z direction, and the flap 1756B on the fixedcomponent 506 limits motion of the moveable component 505 in the +Zdirection. Additionally, as illustrated in FIGS. 17K, 17L and 17N, thegap 1760 between the two components 505 and 506, which may be formed asdiscussed below in connection with FIGS. 49A-49F, may limit motion ofthe moveable component 505 in the X and/or ±Y directions.

As illustrated in FIG. 17M, the respective front ends of the flaps 1756Aand 1756B may define corners at the opposite ends thereof, and one ormore of the corners may incorporate elliptical fillets 1766.

As illustrated in FIGS. 17D-17L and FIGS. 17K-17N, a single snubber flap1758 may be provided for constraining lateral movement of a component,e.g., moveable component 505, in an actuator device 1750. For example,the snubber flap 1758, which in some embodiments may comprisepolysilicon, may extend from a fixed component, e.g., component 506, andtoward but not over, the moveable component 505 to limit motion of themoveable component 505 in the lateral, i.e., in the in the ±X and/or ±Ydirections. As illustrated in FIGS. 17K, 17L and 17N, the gap 1764between the fixed and moveable components 505 and 506 can be maderelatively larger than the gap 1768 between the snubber flap 1758 andthe moveable component 505, such that the snubber flap 1758 does notinterfere with normal rotational motion of the movable component 505,but does function to prevent unwanted lateral motion thereof.

FIG. 18 illustrates a ball-in-socket snubber 513, in accordance with anembodiment. The ball-in-socket snubber 513 may have a substantiallycylindrical ball 518 that is slidably disposed within a substantiallycomplementary cylindrical socket 519. The ball-in-socket snubber 513permits desired movement of the platform 520 with respect to the outerframe 506 and limits other movement.

FIG. 19 illustrates a perspective view of the ball-in-socket 513 and twoframe hinges 526, in accordance with an embodiment. The frame hinges 526may be hinge flexures in the otherwise substantially rigid outer frame506. The frame hinges 526 permit the outer frame 506 to deformout-of-plane while maintained desired rigidity in-plane.

FIG. 20 is a top plan view of an actuator device 400 in accordance withan embodiment, wherein cross-sectional views 21-21 are taken along lines21-21. FIG. 21A is a partial cross-sectional view of the actuator device400 of FIG. 20, as seen along the lines 21-21, showing the actuatordevice 400 in an un-deployed state, and FIG. 21B is a partialcross-sectional view of the actuator device 400 of FIG. 20, as seenalong the lines 21-21, showing the actuator device 400 in a deployedstate.

As seen in FIGS. 20-21B, and as discussed in more detail above, theactuator device 400 may be substantially planar when initially formed,and may include recesses 504, electrical contacts or tabs 404 havingalignment apertures 310, an outer frame 506, a fixed frame 517 coupledto the outer frame 506 for rotational movement relative thereto, amoveable frame 505 coupled to the outer frame 506 for rotationalmovement relative thereto, and an actuator, which, in one embodiment,may comprise an electrostatic, rotationally acting actuator 550incorporating a plurality of interdigitated teeth 560, a fixed portionof which is attached to the fixed frame 517 and a moving portion ofwhich is attached to the moveable frame 505.

In one embodiment, the actuator device 400 may comprise an electricallyconductive material, e.g., a semiconductor, such as polycrystallinesilicon or monocrystalline silicon, and may be formed usingphotolithography techniques, such as etching or micromachining. Theetching may include deep reactive ion etching (DRIE). The micromachiningmay comprise one or more of ion milling, laser ablation, chemicalmechanical polishing (CMP), micro-electrical discharge fainting and/ormicro-forging.

With reference to FIG. 21A, it may be seen that the interdigitated teeth560 of the actuator 550 are, like the other components of the actuatordevice 400, initially disposed coplanar with each other. Accordingly,the application of a voltage differential to the teeth 560 cannot resultin any out-of-plane rotational movement of the moveable frame 505relative to the fixed frame 517, and hence, any corresponding movementof the platform 520 in the Z direction. Accordingly, to effect thelatter type of movement, the actuator device 400 may first be deployedinto a configuration that enables this type of actuation.

As illustrated in FIG. 21B, in one embodiment, this deployment may beeffected by rotating the fixed frame 517 relative to the outer frame506, viz., about a rotational axis 2102 and in the direction indicatedby the arrow 2104 such that the fixed portion of the actuator teeth 560are disposed at a selected angle relative to the moving portion of theactuator teeth 560, and then fixing the angular position of the fixedframe 517 relative to the outer frame 506 at that selected angle. Whenthus deployed, the application of a voltage differential to theinterdigitated teeth 560 of the actuator 550 will result in a rotationalmovement of the moveable frame 505 toward the fixed frame 517, andhence, movement of the platform 520 in the Z direction.

The rotation of the fixed frame 517 to the deployed position relative tothe outer frame 506 and the fixing of its angular position relative tothe latter can be effected in a variety of ways. As discussed above inconnection with FIGS. 14-16, in one embodiment, a deployment stop 510may be provided to limit the out-of-plane rotational movement of thefixed frame 517 to, and fix it at the deployed position, i.e., at theselected angle, in the following manner.

FIGS. 22A and 22B are partial cross-sectional views taken along thelines 22-22 through the deployment stop 510 in FIG. 15 illustrating thedeployment stop 510 disposed in the undeployed state and in the deployedstate, respectively. As illustrated in FIG. 22A, the deployment stop 510is attached to the fixed frame 517 and has a side wall 2208 disposedparallel to and in spaced opposition to a side wall 2210 of the outerframe 506. During deployment, the fixed frame 517 is rotated relative tothe outer frame 506 through the selected angle θ until a lower end 2202of the opposing side wall 2208 of the deployment stop 510 is disposed inabutment with the opposing side wall 2210 of the outer frame 506.

The rotating of the fixed frame 517 relative to the outer frame 506 canbe effected in a number of ways including, for example, by pressing onan upper surface of the fixed frame 517 or by pulling on a lower surfaceof the fixed frame 517, e.g., with a vacuum, until the fixed portion ofthe actuator teeth 560 are disposed at the selected angle θ relative tothe moving portion of the actuator teeth 560.

Additionally or alternatively, as illustrated in FIG. 22B, the rotatingof the fixed frame 517 relative to the outer frame 506 can be effectedor assisted with the use of one or more molds or fixtures 2204 and/or2206. For example, in one embodiment, a fixture 2206 having an outerledge 2211 with an upper surface 2212 corresponding to a lower surface2214 of the outer frame 506 and a central recess 2215 with an uppersurface 2216 corresponding to a lower surface 2218 of the fixed frame517 when it has been rotated to the deployed position, i.e., such thatthe fixed portion of the actuator teeth 560 is disposed at the selectedangle θ relative to the moving portion of the actuator teeth. Theactuator device 400 is placed on the fixture 2206 and the fixed frame517 is then pressed or pulled downward as above until the lower surface2218 of the fixed frame 517 contacts the upper surface 2216 of thecentral recess 2215 of the fixture 2206.

In another embodiment, two fixtures may be used, e.g., the first fixture2206 above, and a second fixture 2204 having an outer ledge 2221 with alower surface 2222 corresponding to an upper surface 2224 of the outerframe 506, and a central protrusion 2225 with a lower surface 2226corresponding to an upper surface 2228 of the fixed frame 517 when ithas been rotated to the deployed position relative to the outer frame506, i.e., such that that the fixed portion of the actuator teeth 506 isdisposed at the selected angle θ relative to the moving portion of theactuator teeth. As illustrated in FIG. 22B, in this embodiment, theactuator device 400 is placed between the first and second fixtures 2206and 2204, and the first and second fixtures 2206 and 2204 are then urgedtoward each other until the fixed portion of the actuator teeth 560 isdisposed at the selected angle θ relative to the moving portion of theactuator teeth 560.

In some embodiments, one, the other, or both of the fixtures 2204 and2206 may incorporate small openings (not illustrated) suitably locatedto enable the fixed frame 517 to be fixed in the deployed position by,for example, one or more of the methods described in more detail below.Additionally, the molds 2204 and 2206 may be fabricated with a number ofassociated sets of the outer ledges 2211 and 2221 and the centralrecesses 2215 and protrusions 2225 so that a number of actuator devices400 can be deployed and then fixed in the deployed positionsimultaneously.

As those of some skill in this art will appreciate, there are other waysof rotating the fixed frame 517 to a selected angular position relativeto the outer frame 506, and accordingly, the forgoing methods should beconsidered as merely exemplary and not as limiting.

As illustrated in FIGS. 15, 16 and 22B, the angular position of thefixed frame 517 relative to the outer frame 506 can be fixed in thedeployed state or angular position, i.e., at the selected angle θ, inseveral different ways. For example, in one embodiment, the lower end2202 of the opposing side wall of the deployment stop 510 can be bondedto the opposing side wall of the outer frame 506 with an adhesive.

In another embodiment, the lower end 2202 of the opposing side wall 2208of the deployment stop 510 can be welded to the opposing side wall 2210of the outer frame 506 in a weldment using, e.g., a laser or electronbeam welder. In another embodiment, the opposing side wall 2208 of thedeployment stop 510 can be bonded to the opposing side wall 2210 of theouter frame 506 with a fillet 1501 of an adhesive.

In another embodiment, a wedge 1502 incorporating the selected angle θcan be bonded between the opposing side wall of the deployment stop 510and the opposing side wall of the outer frame 506 with an adhesive inplace of or in addition to the fillet 1501 of adhesive.

As those of some skill in this art will appreciate, there are other waysin which the fixed frame 517 may be fixed in the deployed position, andaccordingly, the forgoing should be considered as merely exemplary andnot as limiting.

FIG. 23 is top plan view of another embodiment of an actuator device2300 that, unlike the actuator device 400 above, is operable to move anelement 2302, such as a lens, a stage or the like in the plane of thedevice, i.e., rectilinearly in the X, Y directions, and rotationallyabout the Z direction (θZ).

As may be seen in FIG. 23, the substantially planar actuator device 2300includes many of the same features found in the actuator device 400discussed above, as well as other features that are different, given thedifference in the nature of its actuation. The actuator device 2300comprises an outer frame 506, a plurality of fixed frames 517 attachedto the outer frame 506, a plurality of moveable frames 505 disposedparallel to the fixed frames 517, a plurality of motion control flexures2306 respectively coupling the moveable frames 505 to the outer frames517 for respective coplanar, rectilinear movement perpendicularly to thefixed frames 517, and a plurality of actuators 550, each incorporating aplurality of interdigitated teeth 560, a fixed portion of which isattached to the fixed frames 517 and a moving portion of which isattached to the moveable frames 505.

The example actuator device 2300 illustrated in FIG. 23 includes threeactuators 550, arranged radially symmetrical about a central axis of thedevice, each including three comb drives, or banks of interdigitatedteeth 560. However, it should be understood that the number andarrangement of the actuators 550, as well as the number and arrangementof their teeth 560, can vary from that of the particular exampleactuator device 2300 illustrated.

It may be noted in FIG. 23 that the interdigitated teeth 560 of theactuators 550 of the actuator device 2300 extend in a direction that isperpendicular to the direction in which the teeth 560 of the actuators550 of the actuator device 400 of, e.g., FIG. 5A, extend.

Additionally, as illustrated in the enlarged partial top plan view of anactuator 550 of FIG. 24, it should be understood that the interdigitatedteeth 560 of the actuators 550 of FIG. 23 are shown in a deployedposition, i.e., spread apart from one another, for substantiallyrectilinear movement relative to each other. However, as illustrated inFIG. 25A, it may be seen that the interdigitated teeth 560 of theactuator 550 are initially disposed such that the associated fixed andmoveable frames 517 and 505 are spaced apart by about the length of theteeth 560. Accordingly, the application of a voltage differential to theteeth 560 cannot result in any in-plane rectilinear movement of themoveable frame 505 relative to the fixed frame 517, and hence, anycorresponding X, Y or θZ movement of an element 2302 coupled to theformer. Accordingly, to effect the latter type of movement, it isdesirable to deploy the actuator device 2300 into a configuration thatenables this type of actuation.

As illustrated in FIG. 25B, in one embodiment, this deployment can beeffected by moving the associated moveable frame 505 in the direction ofthe arrow 2500 to a deployed position that is coplanar with, parallel toand spaced at a selected distance apart from the associated fixed frame517, and then fixing the moveable frame 505 in the deployed position forsubstantially coplanar, rectilinear movement perpendicularly to theassociated fixed frame 517. As illustrated in FIG. 25C, when thusdeployed, the application and removal of a suitable voltage differentialto the interdigitated teeth 560 of the actuator 550 will result in asubstantially rectilinear movement of the moveable frame 505 toward andaway from the fixed frame 517, as indicated by the double-headed arrow2502 therein, and hence, a corresponding X, Y or θZ movement of anelement 2302 coupled to the moveable frame 505.

There are several different methods and apparatus for moving themoveable frame 505, and hence, the associated moving portion of theteeth 560, of an actuator 550 to the deployed position, as well as forlocking or fixing it in the deployed position.

An example embodiment of one such method and apparatus is illustrated inthe enlarged partial top plan view of the actuator 2300 in FIG. 26. Inthe embodiment of FIG. 26, the deployment method includes forming acoplanar over-center latch 2602 and a fulcrum 2604 on the outer frame506. The latch 2602 is coupled to the outer frame 506 with a spring2606. A coplanar deployment lever 2608 is coupled to the moveable frame505 with a deployment flexure 2310. The deployment lever 2608 has asurface 2612 disposed at an upper end of the lever that is configured asan inclined plane for a camming actuation of and a latching engagementwith the latch 2608, and a notch at a lower end of the lever that isengaged with the fulcrum 2604 for rotational movement of the leverthereabout.

In an example deployment, an acceleration pulse is applied to theactuator device 2300 in the direction of the arrow 2614 while holdingthe outer frame 506 fixed. This causes the deployment lever 2608 torotate about the fulcrum 2604 and toward the outer frame 506. Therotation of the deployment lever 2608 about the fulcrum 2604 causes thedeployment flexure 2310 to urge the moveable frame 505 rectilinearly andperpendicularly upward from the fixed frame 517 and to the deployedposition, where the camming surface 2612 at the upper end of thedeployment lever 2608 actuates and is engaged by the latch 2602 so as tofix the moveable frame 505 in the deployed position, as illustrated in,e.g., FIG. 25B.

FIG. 27 illustrates another embodiment of method and apparatus fordeploying and latching the actuator device 2300 that is similar to thoseof the embodiment of FIG. 26. In this embodiment, the method furtherincludes forming a pull ring 2702 attached to the deployment flexure2310 by a spring 2704 adjacent to the upper end of the deployment lever2608, and then using the pull ring 2702 to rotate the deployment lever2608 about the fulcrum 2604 directly using, e.g., a small needle oranother MEMS device inserted into the pull ring 2702.

FIG. 28 is an enlarged partial plan view of the over-center latch 2602and deployment lever 2608 of the embodiments of FIGS. 26 and 27, showingthe lever 2608 disposed in its original or pre-deployment position 2801,in an intermediate position 2802 in which the camming surface 2612 atthe upper end of the lever 2608 has engaged the latch 2602 and forced itto rotate upward about the spring 2606, and in a final or latchedposition 2803, in which the latch 2602 has been returned to its originalposition by the spring 2602 and engaged over the upper end of thedeployment lever 2608, thereby latching it, and hence, the moveableframe 505 and associated moving actuator teeth 560, in the deployedposition.

In one embodiment, an adhesive can be applied to the junction of thelatch 2602 and the upper end of the deployment lever 2608 to preventthem from disengaging from one another as a result of, for example,shock or vibration.

FIG. 29 illustrates another actuator device 2300 deployment method andapparatus, which include forming a socket 2902 in the outer frame 506,the socket including a plurality of radial protrusions 2904 on an innersurface thereof. A complementary ball 2906 is formed concentricallywithin the socket 2902. The ball 2906 is coupled to the motion controlflexure 2306 through a slot in a side wall of the socket 2902 andincludes a plurality of indentations 2908 that are respectivelycomplementary in configuration to the radial protrusions 2904 on thesocket 2902, The ball 2906 and socket 2902 can be used during deploymentof the actuator device 2300 to reduce the force required to move themoveable frame 505 (not seen in FIG. 29) to the deployed position, andsuch that the moveable frame 505 moves substantially rectilinearly andin a direction substantially perpendicular to the fixed frame 517.

In particular, in a pre-deployment configuration, the ball 2906 andsocket 2902 define a uniform gap 2910 between the two features. However,during deployment of the moving frame 505, a torque, indicated by thearrow, may be applied to the motion control flexure 2306, which iscoupled to the moving frame 505, and cause both it and the moving frame505 to rotate undesirably. However, as illustrated in FIG. 29, when theball 2906 begins to rotate in the socket 2902, the protrusions 2904 ofthe socket 2902 immediately engage the indentations 2908 of the ball2906 and lock to prevent any further rotation of the motion controlflexure 2306 and moving frame 505. As a result, the force required tomove the moveable frame 505 to the deployed position is reduced, andduring deployment, the moveable frame 505 moves substantiallyrectilinearly and in a direction substantially perpendicular to thefixed frame 517.

FIG. 30 illustrates another ball-and-socket method and apparatus usefulin the deployment of the actuator device 2300. In the embodiment of FIG.30, a rectangular socket 3002 is formed in the outer frame 506, and acomplementary rectangular ball 3004 is formed concentrically within thesocket 3002. The ball 3004 is connected to the outer frame 506 by a ballspring 3006 and to the moveable frame 505 (not seen in FIG. 30) by themotion control flexure 2306. As in the embodiment discussed inconnection with FIG. 29 above, the ball 3004 and socket 3002 can be usedwhen moving the moveable frame 505 to the deployed position such thatthe moveable frame 505 moves substantially rectilinearly and in adirection substantially perpendicular to the fixed frame 517.

In particular, during deployment of the moving frame 505, a torque,indicated by the arrow, may be applied to the motion control flexure2306, which is coupled to the moving frame 505, and cause both it andthe moving frame 505 to rotate undesirably. However, as illustrated inFIG. 30, when the rectangular ball 3004 begins to rotate in therectangular socket 3002, the ball 3004 is locked against furtherrotation by the top and bottom boundaries of the socket 3002, therebypreventing any further rotation of the motion control flexure 2306 andmoving frame 505. As a result, the moveable frame 505 movessubstantially rectilinearly and in a direction perpendicular to thefixed frame 517.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 is illustrated in FIGS. 31 and 32. In FIG. 31, the methodincludes forming a resilient cantilever 3102 on the outer frame 506, thecantilever 3102 having an upstanding post 3104, e.g., a plastic post,disposed thereon. A pad 3106 coupled to the moveable frame 505 by adeployment flexure 2310 is also formed. The pad 3106 has an opening 3108extending therethrough that corresponds in size to the circumferentialperiphery of the post 3104, and a lower surface disposed below an uppersurface of the post 3104.

As illustrated in FIG. 32, a downward force may be applied to thecantilever 3102 by, e.g., a moveable chamfered plastic snub 3202, suchthat the upper surface of the post 3104 is depressed below the lowersurface of the pad 3106. The pad 3106 is then urged toward the post3104, e.g., using the chamfered snub 3202, such that the pad 3106 causesthe deployment flexure 2310 to urge the moveable frame 505 to thedeployed position and the opening 3108 in the pad 3104 is centered overthe post 3104. The downward force on the cantilever 3102 is thenreleased, e.g., using the chamfered snub 3202, such that the post 3104slides up into the opening 3108 in the pad 3106 and fixes the moveableframe 505 in the deployed position. As in the latching embodimentsdiscussed above in connection with FIGS. 26-28, it may be desirable insome embodiments to fix the post 3104 in the opening 3108 of the pad3106 with, e.g., an adhesive.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using snubs is illustrated in FIG. 33. The method of FIG. 33includes forming an engagement pad 3302 coupled to the moveable frame505 by a deployment flexure 2310. The method further includes providinga pair of moveable snubs 3304, e.g., soft, plastic snubs, disposed inspaced opposition to each other. Each snub 3304 has a ramp 3306 disposedbilaterally symmetrical with respect to the ramp of the other snub. Theengagement pad 3302 is disposed between the two ramps 3306 of the snubs3304, and the snubs are then urged toward each other such that upper andlower edges 3308 and 3310 of the engagement pad 3302 respectively engagea corresponding one of the ramps 3306 and cause the engagement pad 3302to move laterally and thereby cause the deployment flexure 2310 to urgethe moveable frame 505 to the deployed position.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 is illustrated schematically in FIG. 34. In the embodimentof FIG. 34, the method includes forming a deployment pad 3402 coupled tothe moveable frame 505 by a deployment flexure 2310. The moveable frame505 is coupled to the stationary fixed frame 517 and/or outer frame 506by the motion control flexure 2306. The method further includesproviding a stationary fixture 3404. The fixture 3404 has a chamferedpillar 3406 upstanding therefrom. The actuator device 2300 is urgeddownward toward the fixture 3404, indicated by the arrow 3108, such thatan edge 3410 of the deployment pad 3402 contacts a chamfered surface3412 of the pillar 3406 and causes the deployment flexure 2310 to movelaterally and thereby urge the moveable frame 505 to the deployedposition.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using snubs is illustrated schematically in FIG. 35. In theembodiment of FIG. 35, the method includes forming a deployment stage3502 coupled to the moveable frame 505 by a deployment flexure 2310, thestage 3502 having opposite upper and lower surfaces 3504 and 3506. Themethod further includes providing a pair of snubs 3508 disposed inspaced opposition to each other. Each snub 3508 has a resilient inclinedmotion converter 3510 disposed bilaterally symmetrical with respect tothe motion converter of the other snub. The lower surface 3506 of thedeployment stage 3502 is placed on an upper end of the motion converter3510 of a lower one of the snubs 3508, and a lower end of the motionconverter 3510 of the upper one of the snubs 3508 is urged into contactwith the upper surface 3504 of the deployment stage 3502 such that thedeployment stage 3502 moves laterally and thereby causes the deploymentflexure 2310 to urge the moveable frame 505 to the deployed position.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using snubs is illustrated schematically in FIG. 36. In theembodiment of FIG. 36, the method includes forming a deployment stage3602 coupled to the moveable frame 505 by a deployment flexure 2310, thestage 3602 having a lateral surface 3604. The method further includesproviding top and bottom snubs 3606 and 3608. The bottom snub 3608 has apillar 3610 upstanding therefrom. The pillar 3610 has a chamferedsurface 3612 disposed at an upper end and a lateral surface 3614. Theactuator device 2300 is placed on an upper surface of the bottom snub3608 such that the lateral surface 3604 of the deployment stage 3602 isdisposed in opposition with the lateral surface 3614 of the pillar 3610.The top snub 3606 is then urged downward, indicated by the arrow 3616,and into contact with the chamfered surface 3612 of the pillar 3610 suchthat the bottom snub 3608 moves laterally, causing the lateral surface3614 of the pillar 3610 to contact the opposing lateral surface 3604 ofthe deployment stage 3602 and to urge the deployment stage 3602laterally, thereby causing the deployment flexure 2310 to urge themoveable frame 505 to the deployed position.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using a MEMS device is illustrated schematically in FIG. 37.In the embodiment of FIG. 37, the method includes forming a deploymentpad 3702 coupled to the moveable frame 505 by a deployment flexure 2310,the pad 3702 having a lateral surface 3704. The method further includesproviding a MEMS device having a laterally moveable stage 3706 with anupstanding deployment peg 3708 disposed thereon. The deployment peg 3708has a lateral surface 3710 disposed in opposition to the lateral surface3704 of the deployment pad 3702. The MEMS device is actuated such thatthe stage 3706 and deployment peg 3708 move laterally, indicated by thearrows 3712, and cause the lateral surface 3710 of the deployment peg3708 to contact the opposing lateral surface 3704 of the deployment pad3702 and to urge the deployment pad 3702 laterally, thereby causing thedeployment flexure 2310 to urge the moveable frame 505 to the deployedposition.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using thermal expansion is illustrated schematically in FIG.38. In the embodiment of FIG. 38, the method includes forming adeployment pad 3802 coupled to the moveable frame 505 by a deploymentflexure 2310, the pad 3802 having a lateral surface 3804. The methodfurther includes providing a fixture 3806 having a positive coefficientof thermal expansion and an upstanding deployment peg 3808 disposedthereon. The deployment peg 3808 has a lateral surface 3810 disposed inopposition to the lateral surface 3804 of the deployment pad 3802. Thefixture 3806 is heated such that the fixture 3806 and the deployment peg3808 expand laterally, indicated by the arrow 3812, causing the lateralsurface 3810 of the deployment peg 3808 to contact the opposing lateralsurface 3804 of the deployment pad 3802 and to urge the deployment padlaterally, indicated by the arrow 3814, thereby causing the deploymentflexure 2310 to urge the moveable frame 505 to the deployed position.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using thermal expansion is illustrated schematically in FIG.39. In the embodiment of FIG. 39, the method includes forming adeployment pad 3902 coupled to the moveable frame by a deploymentflexure 2310, the pad 3902 having a lateral surface 3904. The methodfurther includes forming a fixed frame 3906 in the actuator device 2300that has a positive coefficient of thermal expansion or that includes acomponent 3907 having a positive coefficient of thermal expansion, and alateral surface 3908 disposed in opposition to the lateral surface 3904of the deployment pad 3902. The frame 3906 is heated, e.g., during athermal cure of the component 3907, such that the frame 3906 expandslaterally, causing the lateral surface 3908 of the frame 3906 to contactthe opposing lateral surface 3904 of the deployment pad 3902 and to urgethe deployment pad 3902 laterally, thereby causing the deploymentflexure 2310 to urge the moveable frame 505 to the deployed position.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using a vacuum is illustrated schematically in FIG. 40. Inthe embodiment of FIG. 40, the method includes forming a deployment pad4002 coupled to the moveable frame 505 by a deployment flexure 2310, thepad 4002 having a lateral surface 4004. The method further includesproviding a fixture 4006 having a lateral surface 4008 disposed inopposition to the lateral surface 4004 of the deployment pad 4002 and anorifice 4010 extending laterally therethrough. A vacuum, indicated bythe arrow 4012, is applied to the orifice 4010 in the fixture 4006 suchthat the lateral surface 4008 of the fixture 4006 is pulled laterally bythe vacuum 4012 against the lateral surface 4004 of the deployment pad4002, causing the deployment pad 4002 to move laterally, indicated bythe arrow 4014, and the deployment flexure 2310 to urge the moveableframe 505 to the deployed position.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using a magnetic field is illustrated schematically in FIG.41. In the embodiment of FIG. 41, the method includes forming adeployment pad 4102 coupled to the moveable frame 505 by a deploymentflexure 2310, the pad 4102 having a magnet 4104 disposed thereon. Themethod further includes moving a magnetic field, indicated by the arrow4106, over the magnet 4104 on the deployment pad 4102 such that thedeployment pad 4102 moves laterally in the direction indicated by thearrow 4106, thereby causing the deployment flexure 2310 to urge themoveable frame 505 to the deployed position.

Another embodiment of a method and apparatus for deploying the actuatordevice 2300 using electrostatic forces is illustrated schematically inFIG. 42. In the embodiment of FIG. 42, the method includes forming adeployment stage 4202 coupled to the moveable frame 505 by a deploymentflexure 2310. The method further includes providing a stationary stage4204 disposed adjacent to and spaced apart from the deployment stage4204. A voltage differential 4206 is applied to the deployment andstationary stages 4202 and 4204 such that the deployment stage 4202moves laterally in the direction indicated by the arrow 4208 relative tothe stationary stage 4204 and causes the deployment flexure 2310 to urgethe moveable frame 505 to the deployed position.

In addition to the several methods and apparatus described above fordeploying the actuator device 2300 using mechanical, thermal expansion,vacuum, magnetic and electrostatic forces, additional methods exist fordoing so using capillary forces.

FIGS. 43A and 43B schematically illustrate how capillary forcesexhibited by a liquid adhesive can be used to effect or assistdeployment of the actuator device 2300 and to fix the moveable frame inthe deployed position. In FIG. 43A, a hydrophilic moving plate 4302 isdisposed over a hydrophilic stationary plate 4304 by a spring 4306,which may comprise a deployment flexure 2310 or a motion control flexure2306. If a liquid such as water or a liquid adhesive 4308 havingsuitable physical properties is disposed between the two plates 4302 and4304, it will wet the opposing surfaces of the two plates to form ameniscus, indicated by the arrows 4310, and thereby generate a pressuredifference between the adhesive 4308 and the ambient that acts to pullthe moving plate 4302 in translation toward the stationary plate 4304and against the bias of the spring 4306 in the direction of the arrow4312. Curing of the adhesive 4308 effectively fixes the final relativeposition of the two plates 4302 and 4304

A similar arrangement is illustrated in FIG. 43B, except that the movingplate 4302 is rotatably coupled to the stationary plate 4304 by a hinge4314 at an edge thereof. Hence, in the embodiment of FIG. 43B, thepressure difference between the adhesive 4308 and the ambient acts topull the moving plate 4302 rotationally about the hinge 4314 and towardthe stationary plate 4304 in the direction of the arrow 4312.

As those of some skill in this art will appreciate, the same capillaryforces acting in the translational and rotational embodiments of FIGS.43A and 43B above can be harnessed to deploy the actuator device 2300prior to use.

An example embodiment of a method and apparatus for deploying theactuator device 2300 using capillary forces is illustrated in thepartial top plan view of FIG. 44. In the embodiment of FIG. 44, themethod includes forming a moving plate 4402 having an upper portioncoupled to the outer frame 506 by an attachment spring 4404, a lower endcoupled to the motion control flexure 2306 (which is coupled at itsupper end to the moveable frame 505), a side wall 4406 disposed adjacentto and spaced apart from a side wall 4407 of the outer frame 506, a pairof arms 4410 extending toward and defining a gap 4412 between theadjacent side walls 4406 and 4407 of the moving plate 4402 and the outerframe 506, and a pair of registration locks 4414 disposed in the gap4412.

The method further comprises forming a pair of parallel slots 4416 and apair of parallel registration keys 4418 in the adjacent side wall 4407of the outer frame 506. Each slot 4416 is configured to receive arespective one of the arms 4408 of the moving plate 4402, and eachregistration key 4418 is configured to engage in a respective one of theregistration locks 4414 thereof. The method further includes forming aserpentine reservoir 4420 for a liquid adhesive in the outer frame 506and disposed in communication with the gap 4412 between the adjacentside walls 4406 and 4407 of the moving plate 4402 and the outer frame506.

To effect deployment, a suitable liquid adhesive is disposed in the gap4412 such that the adhesive is wicked into the serpentine reservoir 4420in the outer plate 506 and which creates a capillary force between theadjacent side walls 4406 and 4407 of the moving plate 4402 and the outerframe 506 that draws the adjacent side wall 4406 of the moving plate4402 laterally toward the adjacent side wall 4407 of the outer frame506, thereby causing the respective arms 4408, slots 4416, registrationlocks 4414 and keys 4418 of the moving plate 4402 and the outer frame506 to move into engagement with each other, thereby causing the motioncontrol flexure 2306 to urge the moveable frame 505 to the deployedposition.

During deployment, the reservoir 4420 serves to store surplus adhesivewhile the moving plate 4402 moves, and the engagement of thecomplementary registration features 4408, 4416, 4414 and 4418 serves toconfine movement of the moving plate 4402 to substantially lateraltranslational movement.

In some embodiments, the liquid adhesive may be cured or allowed toauto-cure to fix the moveable frame 505 and the associated moving teeth560 (not seen in FIG. 44) in the deployed position, i.e., forsubstantially coplanar, rectilinear movement perpendicularly to thefixed frame 517.

Another example embodiment of a method and apparatus for deploying theactuator device 2300 using capillary forces is illustrated in thepartial top plan view of FIG. 45. In the embodiment of FIG. 45, themethod includes forming a moving plate 4502 coupled to the motioncontrol flexure 2306 by a deployment flexure 2310 and having a side wall4504 disposed adjacent to a side wall 4506 of the outer frame 506. Theadjacent side walls 4504 and 4506 of the moving plate 4502 and the outerframe 506 are formed to respectively contain complementary zigzagpatterns 4508 and 4510 that define a zigzag gap 4512 between theadjacent side walls 4504 and 4506 of the moving plate 4502 and the outerframe 506.

To effect deployment, a liquid adhesive is disposed in the zigzag gap4512 such that the liquid adhesive creates a capillary force between theadjacent side walls 4504 and 4506 of the moving plate 4502 and the outerframe 506 which draws the moving plate 4502 and the deployment flexure2310 laterally toward the outer plate 506, thereby causing the motioncontrol flexure 2306 to urge the moveable frame 505 to the deployedposition. In this embodiment, the length, shape and width of the zigzaggap 4512 are configured to increase the distance that the moving plate4502 moves laterally during deployment while maintaining an adequatedeployment force, and to obviate the need for a reservoir, as in theembodiment of FIG. 44 above, for storage of surplus adhesive.

As discussed above, in some embodiments, the liquid adhesive may becured or allowed to auto-cure to fix the moveable frame 505 and theassociated moving teeth 560 (not seen in FIG. 45) in the deployedposition.

Another example embodiment of a method and apparatus for deploying theactuator device 2300 using capillary forces is illustrated in thepartial top plan view of FIG. 46. In the embodiment of FIG. 46, themethod includes forming a plurality of moving plates 4602 respectivelyinterleaved between a corresponding plurality of stationary plates 4604attached to the outer frame 506 and defining a corresponding pluralityof gaps 4606 between respective outer sidewalls of the moving plates4602 and respective inner sidewalls of the stationary plates 4604. Thepenultimately innermost one 4408 of the moving plates 4402 is formed toinclude an L-shaped arm 4610 that overarches the innermost one 4612 ofthe stationary plates 4604 and extends downwardly and adjacent to anupper end of an inner side wall of the innermost one 4614 of the movingplates 4602.

As illustrated in FIG. 46, the outermost one 4616 of the moving plates4602 is coupled to the outermost one 4618 of the stationary plates 4604with an attachment spring 4620. Adjacent ones of the moving plates 4602intermediate of the outermost and innermost ones 4618 and 4612 of thestationary plates 4604 are respectively coupled to each other with aplurality of attachment springs 4622. The innermost one 4614 of themoving plates 4602 is coupled to the motion control flexure 2306 with adeployment flexure 2310.

To effect deployment, a liquid adhesive is disposed in the gaps 4606such that the liquid adhesive creates a capillary force between theadjacent side walls of the moving plates 4602 and the stationary plates4604 that draws the moving plates 4602 and the deployment flexure 2310laterally, thereby causing the motion control flexure 2306 to urge themoveable frame 505 to the deployed position.

In one embodiment, the liquid adhesive can be disposed in the gaps 4606sequentially, beginning with an outermost one of the gaps 4606 andproceeding inwardly. This enables each succeeding gap 4606 to be madeprogressively smaller so that the selected deployment distance is madelarger while the force required for deployment is maintained relativelyconstant.

As above, in some embodiments, the liquid adhesive may be cured orallowed to auto-cure to fix the moveable frame 505 and the associatedmoving teeth 560 (not seen in FIG. 46) in the deployed position.

Another example embodiment of a method and apparatus for deploying theactuator device 2300 using capillary forces is illustrated schematicallyin FIG. 47. In the embodiment of FIG. 47, the outer end of the motioncontrol flexure 2306 is coupled to the outer frame 506 by a plurality ofattachment springs 4704 coupled to each other and to the motion controlflexure 2306 at a nexus 4706. An inner end of the motion controlflexures 2306 is coupled to the moving frame 505.

In the embodiment of FIG. 47, the method includes forming a moving plate4702 rotatably attached to a stationary plate 4708, e.g., the outerframe 505, by a hinge 4710 at a lower end thereof and defining anangular gap 4712 between adjacent sidewalls of the moving plate 4702 andthe stationary plate 4708. The method further includes forming aconnection beam 4714 coupling the moving plate 4702 to the nexus 4706.

To effect deployment, a liquid adhesive is disposed in the angular gap4712 such that the liquid adhesive creates a capillary force between theadjacent side walls of the moving plate 4702 and the stationary plate4708 that rotates the moving plate 4702 and connection beam 4714laterally about the hinge 4710 and toward the stationary plate 4708,indicated by the arrow 4716, thereby causing the motion control flexure2306 to urge the moveable frame 505 to the deployed position.

As above, in some embodiments, the liquid adhesive may be cured orallowed to auto-cure to lock the moveable frame 505 and the associatedmoving teeth 560 (not seen in FIG. 47) in the deployed position.

Another example embodiment of a method and apparatus for deploying theactuator device 2300 using capillary forces is illustrated schematicallyin FIG. 48. As may be seen in a comparison of FIGS. 47 and 48, thelatter embodiment is substantially similar to the former, with thefollowing differences: The outer end of the motion control flexure 2306is coupled directly to the outer frame 506, the connection beam 4714 iseliminated, and the moving plate 4702 is instead coupled directly to themoveable frame 505 by a deployment flexure 2310.

In the embodiment of FIG. 48, as in that of FIG. 47, deployment iseffected by disposing a liquid adhesive in the angular gap 4712 suchthat the liquid adhesive creates a capillary force between the adjacentside walls of the moving plate 4702 and the stationary plate 4708 thatrotates the moving plate 4702 and deployment flexure 2310 laterallyabout the hinge 4710 and toward the stationary plate 4708, therebycausing the moveable frame 505 to move to the deployed position.

As above, in some embodiments, the liquid adhesive may be cured orallowed to auto-cure to lock the moveable frame 505 and the associatedmoving teeth 560 (not seen in FIG. 48) in the deployed position.

As discussed above in connection with FIG. 14, in some embodiments, theserpentine contact flexure 508 may be utilized to provide anelectrically conductive path between a fixed or stationary section ofthe actuator device 400, e.g., the outer frame 506 or the fixed frame517, and a moveable section, such as the moveable frame 505 or theplatform 520, or alternatively, between two sections that areelectrically isolated from each other by, for example, poorly conductivepolysilicon hinges. In this regard, the serpentine contact flexure 508may be one or more of fabricated of an electrically conductive material,e.g., monocrystalline silicon, and/or plated with an electricallyconductive material, e.g., gold.

As discussed above in connection with FIGS. 18 and 19, in someembodiments, the ball 518 of the ball-in-socket snubber 513 may beconnected to the outer frame 506 through a slot in the complementarysocket 519, and the socket 519 may be formed in the platform 520. Inthese embodiments, the ball-in-socket snubber 513 functions during ashock event to substantially limit motion of the platform 520 relativeto the outer frame 506 and thereby substantially mitigate shock loadsacting on the motion control flexures 515.

As illustrated in FIG. 19, to ensure that the ball 518 remainsconcentrically disposed within the complementary socket 519 at allactuated positions of the platform 520, in some embodiments, it may bedesirable to provide the outer frame 506 with two portions 1902respectively disposed on opposite sides of a third, central portion 1904to which the ball 518 of the ball-in-socket snubber 513 is connected,such that the three portions 1902 and 1904, and hence the ball 518, canbe deployed, i.e., displaced downwardly with respect to the rest of theouter frame 506, and then fixed at that out-of-plane position.

To effect this folding, in some embodiments, the outer frame 506 may beprovided with a pair of folding frame hinges 526 respectively formed atopposite ends of each folding frame portion 1902. As illustrated in FIG.19, the distally opposite folding frame hinges 526 respectively couplethe outer ends of the folding portions 1902 to the outer frame 506, andthe proximally opposite hinges 526 respectively couple the inner ends ofthe folding portions 1902 to the central portion 1904. In thisarrangement, when a deployment force is exerted downward on the centralportion 1904, the folding portions 1902 rotate downwardly about theirouter ends, whereas, the central portion 1904, including the ball 518,moves downward with substantially rectilinear motion. To effect thefixing of the folding frame portions 1902 and the central frame portion1904 in their respective downwardly deployed positions, a fillet 1501 ofan adhesive may be disposed in one or both of the folding frame hinges526, as described above in connection with the fixing of the fixed frame517 in the deployed position.

As discussed above in connection with FIG. 10, in some embodiments, thelateral snubber assembly 1001 may comprise a first snubber member 1002formed on the fixed frame 517 and a bilaterally symmetrical secondsnubber member 1003 formed on the moveable frame 505, which cooperatewith each other to inhibit undesirable lateral motion of the movableframe 505 with respect to the fixed frame 517, and hence, with respectto the outer frame 506, as well, during shocks or large accelerations.An alternative embodiment of the lateral snubber assembly 1754 isillustrated in FIGS. 17D-17J, the latter differing from the formerprimarily in the shape of the ends of the snubber members which, in someembodiments, may each be semi-cylindrical in shape, i.e., may eachcomprise a full radius.

In either of these embodiments, it may be desirable to make the gap “D”between the first snubber member 1002 and the second snubber member 1003very narrow, e.g., about 2-3 micrometers, to limit such undesirablelateral or in-plane motion. As those of skill in this art willappreciate, the direct fabrication of such a narrow spacing between twoadjacent members on a substrate, even using photolithographictechniques, such as DRIE, can be difficult. However, as illustrated inFIGS. 49A-49F, in one embodiment, the gap D can be made at least thisnarrow using the “indirect” photolithographic technique described below.

FIGS. 49A-49F illustrate successive steps in an example embodiment of aphotolithographic process that may be used to fabricate the gap D. Asillustrated in FIG. 49A, a trench 4902 having side walls 4904 and 4906and a bottom end 4908 is formed, e.g., by DRIE, in an upper surface 4910of a substrate 4912, e.g., a silicon substrate.

As illustrated in FIG. 49B, a layer of oxide 4914, e.g., silicon oxide,is formed, e.g., by chemical vapor deposition (CVD) techniques, on atleast the upper surface 4910 of the substrate 4912 such that the oxideforms liners 4916 and 4918 on the corresponding side walls 4904 and 4906of the trench 4902, and a liner 4920 on the bottom end 4908 of thetrench 4902. The oxide wall and bottom end liners 4916, 4918 and 4920may have a thickness of for example, about 2-3 micrometers.

As illustrated in FIG. 49C, a layer of polycrystalline silicon(polysilicon) is then deposited, e.g., using CVD techniques, on at leastan upper surface 4924 of the layer of oxide 4914 on the upper surface4910 of the substrate 4912 and the liners of oxide 4916, 4918 and 4920in the trench 4902.

As illustrated in FIG. 49D, a portion of the layer of polysilicon 4922is then removed, e.g., by masking and etching techniques, from the uppersurface 4924 of the layer of oxide 4914 on the upper surface 4910 of thesubstrate 4912 in an area adjacent to a side wall 4904 of the trench4902 and above the corresponding liner of oxide 4916 disposed thereon.

As illustrated in FIG. 49E, a lower portion of the substrate 4912,including the bottom end 4908 of the trench 4902, is then removed, e.g.,using chemical mechanical planarization (CMP) techniques, such that theliner of oxide 4920 at the bottom end 4908 of the trench 4902 is exposedthrough a lower surface 4924 of the substrate 4912.

As illustrated in FIG. 49F, the liner of oxide 4916 on the correspondingside wall 4904 of the trench 4902, at least a portion of the liner ofoxide 4920 exposed at the bottom end 4908 of the trench 4902, and thelayer of oxide 4914 on the upper surface 4910 of the substrate 4912adjacent to the side wall 4904 of the trench 4902 is then removed, e.g.,using masking and etching techniques, thereby resulting in a gap 4926having a width equal to the liner of oxide 4916 that was removed fromthe corresponding side wall 4904 of the trench, viz., about 2-3micrometers.

As illustrated in FIGS. 50-53, in one embodiment, the foregoingphotolithography method can be used advantageously to form aninterlocking flap feature 5000 similar to the interlocking snubber flapsfeature 1756 discussed above in connection with FIGS. 17D-17N and usefulfor controlling out-of-plane Z deflection of a moveable component 5002,e.g., a moveable frame 505, relative to a fixed component 5004, e.g., afixed frame 517, to which the moveable component 5002 is rotatablycoupled, e.g., with hinges or flexures (not seen in FIGS. 50-53). Theinterlocking flaps feature 5000 functions to substantially preventexcessive motion of the moveable component 5002 in the ±Z directionsabout a hinge line 5006, thereby protecting the hinging elements (notseen) from excessive out-of-plane or Z deflection. The restraintprovided by the interlocking flap feature 5000 has a relatively lowstiffness so as to prevent high contact decelerations, and hence, forcesacting on the hinging elements (not seen), yet allows intended rotationsof the moveable component 5002 to occur about the hinge line 5006 duringoperation, i.e., actuation, of the actuator device 400.

In the example embodiment of FIGS. 50-53, as in the method describedabove in connection with FIGS. 49A-49F, an example method for formingthe interlocking flap feature 5000 begins with the formation of a trench5008, e.g., using DRIE, between the moveable and fixed components 5002and 5004, which may be comprised of a semiconductor, e.g.,monocrystalline silicon. FIGS. 52A and 52B are enlarged partial top andbottom plan views, respectively, of the interlocking flap feature 5000.As may be best visualized in the bottom plan view of FIG. 52B, thetrench 5008 describes an alternating, sinuous path between the twocomponents 5002 and 5004 that can be radially symmetrical about a Z axisextending through the center thereof. As in the above method, a liner5010 of an oxide, e.g., SiO2, is then deposited on the walls of thetrench 5008 and at least the upper surface of the two components 5002and 5004, as illustrated in FIGS. 53A and 53B, followed by thedeposition of a layer 5012 of, e.g., polysilicon, on the oxide liner5010.

As illustrated in the top plan view of FIG. 52A, the oxide liner 5010and polysilicon layer 5012 are then etched away from selected areas ofthe walls of the trench 5008 and upper surfaces of the two components5002 and 5004 using, e.g., isotropic and anisotropic etching techniques,to define two oppositely directed, rectangular, polysilicon flaps 5014Aand 5014B that are respectively disposed on the fixed and moveablecomponents 5004 and 5002, and that respectively overhang the opposingcomponent. In particular, the oxide liner in the areas underlying thetwo polysilicon flaps 5014A and 5014B can be partially or completelyremoved, e.g., by an isotropic etching technique, such that the twoflaps 5016A and 5016B are respectively disposed over and spaced apartfrom corresponding silicon shoulders 5016A and 5016B respectivelydisposed on the opposing moveable and fixed components 5002 and 5004.Thus, the oxide liner 5010 disposed between the two flaps 5016A and5016B and the respectively corresponding shoulders 5016A and 5016B isremoved.

FIGS. 53A and 53B are enlarged partial cross-sectional views through theflaps 5014A and 5014B, respectively, as seen along the correspondinglines of the sections 53A-53A and 53B-53B taken in FIG. 51, showing theoperation of the interlocking flaps feature 5000 to restrain motion ofthe moveable component 5002 in the +Z and −Z directions, respectively.As illustrated in FIG. 53A, the flap 5014A functions by making arestraining contact with a line 5018A on the underlying shoulder 5016Aon the moving part 5002 when the latter is moved in the +Z direction. Asillustrated in FIG. 53B, the flap 5014B functions by making arestraining contact with a line 5018B on the underlying shoulder 5016Bon the fixed component 5002 when the moving portion 5002 is moved in the−Z direction.

FIGS. 17D-17F illustrate an alternative embodiment of an interlockingsnubber flaps feature 1756 useful for constraining both verticalmovement of a component, e.g., moveable component 505, in the ±Zdirections, as well as lateral movement thereof, i.e., in the ±X and/or±Y directions, as discussed above.

As illustrated in FIG. 17F, this interlocking flaps feature includes theformation of a pair of flaps 1756A and 1756B respectively extending frommoveable and fixed components 505 and 506 and over a correspondingshoulder 1762 formed on the other, opposing component, as discussedabove.

As illustrated in FIG. 17M, the respective front ends of the flaps 1756Aand 1756B may define corners at the opposite ends thereof, and one ormore of the corners may incorporate elliptical fillets 1766, asdiscussed above.

As illustrated in FIGS. 17D-17L and FIGS. 17K-17N, a single snubber flap1758 may be provided for constraining lateral movement of a component,e.g., moveable component 505, in an actuator device 1750. For example,the snubber flap 1758, which in some embodiments may comprisepolysilicon, may extend from a fixed component, e.g., component 506, andtoward but not over, the moveable component 505 to limit motion of themoveable component 505 in the lateral, i.e., in the in the ±X and/or ±Ydirections, as discussed above. As illustrated in FIGS. 17K, 17L and17N, the gap 1764 between the fixed and moveable components 505 and 506can be made relatively larger than the gap 1768 between the snubber flap1758 and the moveable component 505, such that the snubber flap 1758does not interfere with normal rotational motion of the movablecomponent 505, but does function to prevent unwanted lateral motionthereof, as discussed above.

Although the actuator disclosed herein is described as a MEMS actuator,such description is by way of example only and not by way of limitation.Various embodiments may include non-MEMS actuators, components ofnon-MEMS actuators, and/or features of non-MEMS actuators.

Thus, an actuator suitable for use in a wide variety of differentelectronic devices may be provided. Motion control of the actuatorand/or items moved by the actuator may also be provided. As such, anenhanced miniature camera for use in electronic devices may be provided.

According to various embodiments, smaller size and enhanced shockresistance for miniature cameras are provided. Enhanced fabricationtechniques may be used to provide these and other advantages. Thus, suchfabrication techniques may additionally enhance the overall quality andreliability of miniature cameras while also substantially reducing thecost thereof.

Where applicable, the various components set forth herein may becombined into composite components and/or separated into sub-components.Where applicable, the ordering of various steps described herein may bechanged, combined into composite steps, and/or separated into sub-stepsto provide features described herein.

Embodiments described herein illustrate but do not limit the disclosure.It should also be understood that numerous modifications and variationsare possible in accordance with the principles of the disclosure.

What is claimed is:
 1. A device comprising an actuator, the actuatorcomprising: an outer frame; a fixed frame attached to the outer frame; amoveable frame disposed parallel to the fixed frame; a motion controlflexure coupling the moveable frame to the outer frame; an elementcoupled to the moveable frame for movement relative to the fixed andouter frames and movement about a central axis of the element and,wherein one of the moveable frame and the fixed frame is fixed at adeployed position that is spaced a selected distance apart from theother of the moveable frame and the fixed frame.